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For reduction the transmission loss, impedance matching
Low Dielectric constant, Low Dissipation factor Coverlay and bonding sheet
Low Dk/Df materials for high frequency design. High adhesive strength with LCP film, and can be cure by press on 160 degree C.
Use cases:
Flexible high speed transmission circuit -
Ground wiring is unnecessary! Reflow available
Electro magnetic absorption sheet
Suppression noise by absorb the high frequency noise. Thin and light, also no need the ground wiring. Because having resistance for reflow and plating process, it can be use before parts mounting process.
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For bonding between gap cannot be applied pressure
Foaming adhesive sheet
Available to fill the gap and adhesion by changing its own thickness by foaming with heat. It has heat resistance, heat shock cycle resistance and ATF oil resistance.
Use cases:
Fixing of permanent magnetic for IPM motor
Vehicle-mounted items or more -
For bonding with material cannot apply high temperature
Low temperature curing adhesive sheet
Can stick easily because of tackiness, and bonding by curing with over 70 degree C. Because of thermosetting type, has the heat resistance and water proof after cured.
Use cases:
For bonding with low heat resistance materials -
We proposed that our new material has some properties which are uniquely flexible and high in tracking to a cultured cell sheet
ATTRAN®
Our new product has been created by applying special polymer on the polylactic acid non-woven fabric.
Thus it is uniquely flexible and high in tracking to a cultured cell sheet and the affected body part.
* Adoption results:
・St. Marianna University
・Other research institutions for Cultured Cell
