Materials for Flexible Printed Wiring Boards
NIKKAN was one of the first companies to focus on thin, light flexiblewiring boards suitable for lighter and smaller electronic devices, and became .lapanl s first manufacturer to succeed in mass-producing materials for flexible printed wiring boards. Since then, the excellent quality of our products has been recognized throughout the world.
NIKAFLEX® - Copper Clad Laminate for Flexible Printed Circuits F-series
F-series：It is copper clad laminates material for flexible printed circuits. Film and copper are
laminated by insulation adhesive. According to customers’ demand, different compositions are
available(various polyimide film, various copper, various adhesive)
Application： mobile device, automotive, camera, electronic components etc.
- F-series code meaning
- F-30VC1 / F-30VC2
Polyimide film base copper clad laminate for flexible printed circuits (halogen contained)
- F-50VC1 / F-50VC2
High insulation reliability polyimide film base copper clad laminate for flexible printed circuits (halogen contained)
NIKAFLEX® - Coverlay film for Flexible Printed Circuits C-series
C-series：They are material for flexible printed circuits Functional adhesive is coated on one side
of polymidefilm and separator is laminated. They are used according to high heat resistance,
high insulation reliability,low DK characteristic and application. Ultra-thin base polymide film
from 5μm is available.
Application：mobile device, automotive, camera, electronic components etc.
- C-series code meaning
- C IS V
Polymide film base coverlay for general purpose (halogen contained)
- C IS A
High insulation reliability polymide film base coverlay (halogen contained)
- C KS E
Halogen free polyminde film base coverlay for general purpose
- C NS F
High insulation reliability halogen free polymide film base coverlay
- C IS G
High Tg・High insulation reliability halogen free polymide film base coverlay
- C NS Y
Low Dk・low Df halogen free polymide film base coverlay
NIKAFLEX® - Bonding Sheet SA-series
SA-series：They are bonding sheets with separator. They are currently used in bonding purpose for flexible printed circuits and electronic components.
They have excellent adhesion to various kinds of material. They are used according to insulation reliability, low DK characteristic and high thermal conductivity purpose.
Applications：stiffener , multilayer board, electronic components , metal components
- SA-series code meaning
- SA FW
High tack bonding sheet for stiffener
- SA FA
High insulation reliability bonding sheet
- SA FV
Bonding sheet for general purpose
- SA FG
Halogen free high Tg bonding sheet
- SA FP
Halogen free bonding sheet for multilayer FPC
- SA FN
Halogen free high adhesion bonding sheet
- SA FY
Halogen free low DK bonding sheet
- SA FU
Halogen free thermal conductive white bonding sheet
Introduction to NIKKAN Departments（Laminated Products Department）
The Laminated Products Department handles materials for flexible wiring boards that are suitable for downsizing and higher performance of electronic devices since they are thin and light, and more importantly, flexible. The product lineups include copper-clad laminates (CCL) for flexible wiring boards, cover layers (CL) and adhesive sheets as well as rigid-flexible compatible materials, a combination of FPC and rigid boards, thus allowing us to meet diversified user needs. All of these products are manufactured at our production subsidiary Takahagi Nikkan Co., Ltd., which has acquired ISO9001 certification, to ensure a structure to provide high-quality products.
Laminated Products Department
Tel: 03-3723-9853 / e-mail: firstname.lastname@example.org
Osaka Seles Office